Application

Wafer chuck for semiconductor dicing,grinding,washing…etc.

Features

• Reusable

  Reusable after rework.

• wear resistance

  With the feature of extreme hardness of ceramics.

• No dust

  Completely sintered, without dust.

• Light weight

  With uniform pores, and light weight.

Brief introduction

Work Pieces can be adhesively fixed by aligning the porous to the body of the metal (or ceramic), and applying negative pressure from the back and sides of the body.

Due to the pores that are very tiny and averagely spread, vacuum chuck would not cause harms and scratch on your work pieces, improving the yield rate, making the best partner of manufacture.

Basic porous structure

Cross-section of aluminum chuck table

With larger and limited pores, distortion of workpiece might occur.

Specifications